Main Office

Repacking Machine


The repacking and control machine is part of a production line for sensor modules. The sensor modules are fed to the machine in a carrier tape, manually transferred to a rotary indexing table, subjected to an optical control, marked with a datamatrix code and then packed in a reel.











Technical details

Processing of sensor modules
Cycle time: <6sec depending on testing time and manual handling time
Processing of ESD sensitive components
Control: VME bus, CAN bus

Process sequence

The modules are fed progressively into the machine in a carrier by the inlet conveyor. The inlet operator takes the modules from the carrier and places them on the rotary indexing table. Here they are subjected to an electrical preliminary test and complete contact of components is tested. A printer marks the modules with a datamatrix code. The outlet operator places the module in the carrier tape of the outlet system and places faulty parts on the bad part conveyor. The description of the structure follows the stations which process the components


Unpacking and assembling

The blister tape removal module is designed for unpacking the components from the blister tape. The carrier tape is conveyed as the sealing tape is removed by a nip roll, driven by a step motor. The presence of a component in the tape is monitored by a sensor.

After unpacking, silicon residues are removed from the components and the unpacked components are placed on the component holder. The position of the diode chips is measured and a good/bad result is issued. The position of the camera can be adjusted in x, y and z direction via micrometre screws.


Welding station

The sealing module is designed to position particularly flexible printed circuit boards on blister tape of 44 mm in width. Transport of the carrier tape is driven by a step motor. The rigid part of the flexible printed circuit boards protrudes out of the tape and they are fixed on the blister tape using adhesive film.


Reading the datamatrix code and testing

The components are flipped in order to read the DMC. The components are electrically tested in the test station. Testing can be carried out either from above or below. The probe card required for testing can be replaced.