Main Office

IT Testers


The IT Tester integrates the following three functions: testing, marking and packaging, in a single machine. The machine processes components in flip chip or SMD technology. The machine can be retooled according to the respective component type. The components are picked up from adhesive film or trays, positioned, measured, sorted, marked with a laser and packed in tapes.










Technical details

  • The IT Tester offers 3 functions in one: testing – marking - packaging

  • Components: flip chip, SMD, modules

  • Smallest component size that can be processed: 1.4mm x 2mm

  • Typical cycle time: ≤2s depending on the testing time

  • Processing of 4”, 5”, 6”, 8” wafers and 12“ wafers (requires modifications)



The handling system is adapted to customised testing tasks, the supplied testing equipment including testing socket is used. The testing socket can be positioned using an adapter. Testing can be carried out at a set pressure force.

The laser system is variable. Different performance classes can be selected, along with different marking types, clear text, bar code or DMC. After marking, the quality can be checked by image processing.

The tape module is also freely configurable with regard to heat or cold sealing, different tape widths, Surftape or position checks on the tape.



  • Input system: Trays or frames with components in magazines

  • Transport system: 2 rotary indexing tables with pick-up tools and transfer unit

  • Positioning: Positioning via step motors before pick-up and testing of components

  • Marking: Integrated laser system, performance class can be selected


Process sequence

  • The lift picks up a magazine with max. 25 frames or trays

  • The exchanger takes the tray/frame and places it on the XY table.

  • The XY table moves the tray/frame or the individual components beneath the camera system. Detected components are positioned centrally in relation to the punching needle.

  • Station 1: The component is sucked up and removed from the tray.

  • Station 2: The component is tilted vertically by 180°. The camera records the position of the contact surface as well as the position of pin 1. This data is forwarded to station 3 for correction of the testing socket.

  • Station 3: After contact, electrical testing of the component is carried out. The result of the test determines whether the component is to be rejected at station 4, 5 or 7 or whether it is to be passed on to rotary indexing table 2 in station 6.

  • Station 4: The component is tilted back to its original position (180°) and its presence is detected by a light barrier. Should the component be faulty, it is dropped into the reject container by compressed air.

  • Station 5: Reject container for test rejects

  • Station 6: “Good“ components are transferred to rotary indexing table 2.

  • The components are marked on rotary indexing table 2 and then transferred to the taping module.


Taping module

The taping module positions the components correctly in the tape. The correct put-down position is checked by image processing. The tape is sealed (welded or bonded) and then wound on to a reel.